Intel's going "100 percent lead-free" in its entire 45 nanometer high-k metal gate (Hi-k) line, the top processor maker announced today.

Lead is used in a variety of micro-electronic "packages" and the "bumps" that attach an Intel chip to the packages. Packages wrap around the chip and ultimately connect it to the motherboard. Different types of packages are used for processors targeted at specific market segments, including mobile, desktop and server. Package designs include pin grid array, ball grid array and land grid array, and all are 100 percent lead-free in Intel's 45nm Hi-k technology generation. In 2008, the company will also transition its 65nm chipset products to 100 percent lead-free technology.

Lead is poisonous, which is why they advise against letting toddlers feast on old paint chips. And though no one is likely to go licking computer chips -- and shame on you if you do -- the bigger fear is that the lead solder within the chips may leech into the ecosystem.

What will take its place?

To replace the remaining 5 percent (about .02 grams) of lead solder historically found in the first-level interconnect -- the solder joint that connects the silicon die to the package substrate -- in processor packages, Intel will use a tin/silver/copper alloy. It is the way in which Intel will implement these new materials to replace the tin/lead solder that is the "secret sauce" of the company's solution. Because of the complex interconnect structure of Intel's advanced silicon technologies, a great deal of engineering work was required to remove the remaining lead in Intel's processor packages and integrate a new solder alloy system.

Secret sauce, indeed!

[via TG Daily]

Update: I have just been informed that AMD went lead-free ages ago.